Explore how SPT’s plasma and thermal systems are used across semiconductor applications—from MEMS to power devices. Discover our solution-driven technologies.
Explore PECVD basics, key differences from LPCVD & ALD, tool performance, and practical solutions for film stress and plasma damage with real data.
Learn how low-temperature PECVD balances tight thermal budgets with film quality. Explore key trade-offs, thermal budgets, and dielectric metrics.
Learn how PECVD parameters—frequency, gas ratios & temp—tune SiO2/SiN film stress and refractive index. Real process data included.
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Understand Bosch process scalloping in Si DRIE, its impact on device leakage and TSV voids, and trade-offs in reduction techniques based on industry data.
Learn Si DRIE Bosch process basics with SF6/C4F8, key challenges like scalloping and ARDE, and its essential role in MEMS and TSV manufacturing.
Learn MEMS manufacturing, Si DRIE, Bosch and cryogenic processes, plus mass-production challenges such as stiction and notching.
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