Explore how SPT’s plasma and thermal systems are used across semiconductor applications—from MEMS to power devices. Discover our solution-driven technologies.
Understand Bosch process scalloping in Si DRIE, its impact on device leakage and TSV voids, and trade-offs in reduction techniques based on industry data.
Learn Si DRIE Bosch process basics with SF6/C4F8, key challenges like scalloping and ARDE, and its essential role in MEMS and TSV manufacturing.
Explore Si DRIE Bosch process basics & case studies with AR >60 and etch rates >30 µm/min. Download the free guide for MEMS and TSV process design.
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Learn MEMS manufacturing, Si DRIE, Bosch and cryogenic processes, plus mass-production challenges such as stiction and notching.
SPT supports TSV-based 3D integration through high-speed deep etching and high-quality PECVD. Discover our advanced packaging solutions.
Explore SPT’s solutions for micro LED fabrication, including plasma etching and PECVD technologies for material control and thin film precision.
Learn how SPT supports MEMS device fabrication through plasma etching and PECVD technologies. Explore solutions for precise, scalable MEMS production.
Advanced Etching and PECVD Solutions for Next-Generation Power Semiconductor Devices.
SPT provides low-damage etching and deposition systems optimized for GaN-HEMT processes, supporting RF device integration and performance.
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